Samsung's Next-Gen HBM3E Chips Approved for Integration into Nvidia's AI Chips by Sources Close to the Matter

Insiders have revealed to Reuters that the initial Samsung HBM3E chips have successfully passed Nvidia's validation tests. This development paves the way for these memory modules to be integrated into Nvidia's AI chips. Samsung is poised to supply these high-performance memory chips to Nvidia starting from the end of this year.

Sources quoted by Reuters confirm that Nvidia has given the green light for the use of Samsung's 8-layer HBM3E chips. However, the higher-capacity twelve-layer variants are still undergoing testing. While a supply agreement between Samsung and Nvidia is yet to be finalized, sources suggest that it will be in place soon. It is anticipated that Samsung will commence supplying HBM3E chips to Nvidia in the final quarter of this year. Both companies have refrained from making any official comments regarding this development.

An earlier report from the news agency had indicated that Nvidia had approved Samsung's standard HBM3 chips for use in processors targeted at the Chinese market. These chips, however, are not as powerful as Nvidia's most advanced AI chips. Samsung has been working diligently to meet Nvidia's stringent requirements since last year, overcoming initial challenges related to heat and power consumption. Despite reports of setbacks, Samsung has iterated that their testing process is steadily progressing. Insiders suggest that Samsung may have refined their HBM3E design to address these issues.

HBM, also known as High-Bandwidth Memory, is a memory technology commonly utilized in graphics cards for its high bandwidth capabilities. This memory type has found predominant usage in data centers. Samsung's 8-layer HBM3E memory boasts impressive speeds of 8Gbit/s per pin, translating to approximately 1.02TB/s per module. The twelve-layer variants offer even higher bandwidths of up to 1.28TB/s.

The surge in demand for HBM memory, driven by advancements in AI technologies, has resulted in a significant strain on supply. SK hynix, a major manufacturer of HBM memory, disclosed in May that their production capacity for the current year has been fully booked for the remainder of the year, with limited availability for 2025 as well.